Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336112 | High aspect ratio vias filled with liquid metal fill | Mark Crain, Justin Roehm, Thomas Jacob Hammann, Nathan Robertson, Jeremy Brown +4 more | 2025-06-17 |
| 12255047 | Embedded high-z marker material and process for alignment of multilevel ebeam lithography | Maxwell Choi, Melanie S. Yajima, Sieu Ha, Maggy Lau, Clayton Jackson +2 more | 2025-03-18 |