Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12270768 | Method of processing a cleaved semiconductor wafer | Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, William L. Luter | 2025-04-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12270768 | Method of processing a cleaved semiconductor wafer | Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, William L. Luter | 2025-04-08 |