Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394724 | Chip package structure and electromagnetic interference shielding package module thereof | Chih-Hao Liao, HSIN-YEH HUANG | 2025-08-19 |
| 12374629 | Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly | Chih-Hao Liao, HSIN-YEH HUANG | 2025-07-29 |
| 12214436 | Laser soldering system and light shaping method thereof | Yu-Chen Chang, Chun-Fei Kung, Shih-Yung Chiu | 2025-02-04 |