Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394724 | Chip package structure and electromagnetic interference shielding package module thereof | HSIN-YEH HUANG, Shu-Han Wu | 2025-08-19 |
| 12374629 | Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly | Shu-Han Wu, HSIN-YEH HUANG | 2025-07-29 |