Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12207405 | Beveled overburden for vias and method of making the same | Dhananjay Joshi, Chukwudi Azubuike Okoro | 2025-01-21 |
| 12200875 | Copper metallization for through-glass vias on thin glass | Yiu-Hsiang Chang, Jen-Chieh Lin, Prantik Mazumder, Pei-Lien Tseng | 2025-01-14 |