Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12200875 | Copper metallization for through-glass vias on thin glass | Yiu-Hsiang Chang, Jen-Chieh Lin, Prantik Mazumder, Scott Christopher Pollard | 2025-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12200875 | Copper metallization for through-glass vias on thin glass | Yiu-Hsiang Chang, Jen-Chieh Lin, Prantik Mazumder, Scott Christopher Pollard | 2025-01-14 |