Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12379676 | Package imaging for die location correction in digital lithography | Ulrich Mueller, Hsiu-Jen Wang, Jang Fung Chen | 2025-08-05 |
| 12381103 | Multiple substrate handling system and method | Hsiu-Jen Wang, Sin-Yi Jiang, Neng-rui Dong, Chia-Hung Kao, Bang-Yu Liu +1 more | 2025-08-05 |