HW

Hsiu-Jen Wang

Applied Materials: 2 patents #272 of 1,465Top 20%
Overall (2025): #121,067 of 469,880Top 30%
2
Patents 2025

Issued Patents 2025

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12379676 Package imaging for die location correction in digital lithography Ulrich Mueller, Shih-Hao Kuo, Jang Fung Chen 2025-08-05
12381103 Multiple substrate handling system and method Sin-Yi Jiang, Neng-rui Dong, Shih-Hao Kuo, Chia-Hung Kao, Bang-Yu Liu +1 more 2025-08-05