Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979977 | Circuit board with heat dissipation structure and method for manufacturing same | HSIAO-TING HSU, MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN | 2024-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979977 | Circuit board with heat dissipation structure and method for manufacturing same | HSIAO-TING HSU, MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN | 2024-05-07 |