Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156348 | Embedded circuit board and manufacturing method thereof | Cheng-Yi Yang, Hao Zhong, Biao Li, Ning Hou | 2024-11-26 |
| 12063752 | Methods of manufacturing circuit board and circuit board assembly | Wen-Zhu Wei, FU-YUN SHEN, Hong Guo | 2024-08-13 |
| 12048084 | Covering film, and circuit board and manufacturing method | HSIAO-TING HSU, Katsumi Fujiwara, FU-YUN SHEN, Fu-Wei Zhong | 2024-07-23 |
| 11991838 | Embedded circuit board and manufacturing method thereof | Cheng-Yi Yang, Hao Zhong, Biao Li, Ning Hou | 2024-05-21 |
| 11979977 | Circuit board with heat dissipation structure and method for manufacturing same | HSIAO-TING HSU, Tao Liao, XIAN-QIN HU, FU-YUN SHEN | 2024-05-07 |
| 11950357 | Circuit board for transmitting high-frequency signal and method for manufacturing the same | FU-YUN SHEN, Hong Guo, HSIAO-TING HSU | 2024-04-02 |
| 11902644 | Camera module and method for manufacturing the same | Jun Dai, Mei Yang | 2024-02-13 |