Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12152350 | One-step integrally-formed bamboo sleeper and preparation method thereof | Jinbo Hu, Jian PENG, Weihong Zeng, Yanhui Xiong, Diqin Liu +5 more | 2024-11-26 |
| 11919192 | Bamboo chip integrated material and manufacturing method thereof | Zhiping Wu, Jinbo Hu, Yanhui Xiong, Zhicheng Xue, Zhibin HU +1 more | 2024-03-05 |
| 11879076 | Composition, adhesive film and chip packaging structure | De Wu, Shuhang Liao, Junxing Su | 2024-01-23 |