Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12098230 | Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure | De Wu, Yi-Ching Wang, Junxing Su | 2024-09-24 |
| 12037488 | Liquid molding compound and preparation method thereof | De Wu, Shengquan Wang, Junxing Su | 2024-07-16 |
| 12024591 | Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate | De Wu, Yi-Ching Wang, Junxing Su | 2024-07-02 |
| 11978686 | Chip protective film and method for manufacturing same, and chip | De Wu, Liu Zhang, Junxing Su | 2024-05-07 |
| 11879076 | Composition, adhesive film and chip packaging structure | De Wu, Ting Li, Junxing Su | 2024-01-23 |