Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12103999 | Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board | Akihiro Nakamura, Yuji TAKASE, Hayato SAWAMOTO, Shuji NOMOTO, Shota Okade | 2024-10-01 |
| 12064847 | Processing method of workpiece | — | 2024-08-20 |
| 12030157 | Processing method | — | 2024-07-09 |
| 11980993 | Method of grinding workpiece | — | 2024-05-14 |
| 11958101 | Method for manufacturing forged article | Tatsuya Shouji, Shuho Koseki, Kenichi Inoue, Katsuhiro Obata, Satoshi Murakami +6 more | 2024-04-16 |