Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12103999 | Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board | Akihiro Nakamura, Yuji TAKASE, Yoshikazu Suzuki, Shuji NOMOTO, Shota Okade | 2024-10-01 |