Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176278 | 3D chip package based on vertical-through-via connector | Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Chiu-Ming Chou | 2024-12-24 |
| 12062618 | Chip package | — | 2024-08-13 |
| 11894306 | Chip package | — | 2024-02-06 |