Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176278 | 3D chip package based on vertical-through-via connector | Ping-Jung Yang, Mou-Shiung Lin, Jin-Yuan Lee, Chiu-Ming Chou | 2024-12-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176278 | 3D chip package based on vertical-through-via connector | Ping-Jung Yang, Mou-Shiung Lin, Jin-Yuan Lee, Chiu-Ming Chou | 2024-12-24 |