YL

Yu-Hsiang Lin

UM United Microelectronics: 10 patents #8 of 576Top 2%
HL Himax Technologies Limited: 2 patents #10 of 60Top 20%
Overall (2024): #5,264 of 561,600Top 1%
13
Patents 2024

Issued Patents 2024

Patent #TitleCo-InventorsDate
12110374 Recyclable crosslinked polymeric foam and applications thereof Yung-Shen Chang, Chun-Fan Hsieh 2024-10-08
12094956 Semiconductor device and method for fabricating the same Chin-Hung Chen, Ssu-I Fu, Chih-Kai Hsu, Chia-Jung Hsu 2024-09-17
12094783 Semiconductor device and method for fabricating the same Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen 2024-09-17
12074070 Semiconductor device and method for fabricating the same Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen 2024-08-27
12068309 Semiconductor device and method for fabricating the same Chih-Kai Hsu, Ssu-I Fu, Chien-Ting Lin, Chia-Jung Hsu, Chun-Ya Chiu +1 more 2024-08-20
12057483 Semiconductor device including gate oxide layer and manufacturing method thereof Ming-Hua Tsai, Jung Han, Ming-Chi Li, Chih-Mou Lin, Yu-Hsiang Hung +1 more 2024-08-06
12040396 High voltage semiconductor device including buried oxide layer Sheng-Yao Huang, Yu-Ruei Chen, Zen-Jay Tsai 2024-07-16
11990507 High voltage transistor structure Chin-Hung Chen, Ssu-I Fu, Chih-Kai Hsu, Chun-Ya Chiu, Chia-Jung Hsu 2024-05-21
11983351 Touch detection device and touch data transmission method thereof Chun-Kai Chuang, Jan-Ruei Lin, I-Sheng Chao 2024-05-14
11972077 Resetting system and method Yu Nian Ou, Chun-Kai Chuang, Pei-Yuan Hung 2024-04-30
11935854 Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads Chung-Sung Chiang, Chia-Wei Liu, Yu-Ruei Chen 2024-03-19
11901239 Semiconductor device and method for fabricating the same Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen 2024-02-13
11869953 High voltage transistor device and method for fabricating the same Sheng-Yao Huang, Yu-Ruei Chen, Zen-Jay Tsai 2024-01-09