Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935854 | Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chia-Wei Liu, Yu-Ruei Chen, Yu-Hsiang Lin | 2024-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935854 | Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chia-Wei Liu, Yu-Ruei Chen, Yu-Hsiang Lin | 2024-03-19 |