WH

Wen-Han Hung

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Tainan, TW: #299 of 783 inventorsTop 40%
Overall (2024): #224,794 of 561,600Top 45%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12087627 Method for forming a device with an extended via semiconductor structure Hung Hsun Lin, Che-Chih Hsu, Wen-Chu Huang, Chinyu Su, Yen-Yu Chen +1 more 2024-09-10