Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087627 | Method for forming a device with an extended via semiconductor structure | Hung Hsun Lin, Wen-Chu Huang, Chinyu Su, Yen-Yu Chen, Wei-Chun Hua +1 more | 2024-09-10 |
CH
Che-Chih Hsu
Overall (2024): #512,361 of 561,600Top 95%
1
Patents 2024