Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087627 | Method for forming a device with an extended via semiconductor structure | Hung Hsun Lin, Che-Chih Hsu, Wen-Chu Huang, Chinyu Su, Yen-Yu Chen +1 more | 2024-09-10 |
WH
Wei-Chun Hua
Overall (2024): #224,870 of 561,600Top 45%
1
Patents 2024