Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183626 | Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho +1 more | 2024-12-31 |