Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183626 | Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai +1 more | 2024-12-31 |
| 12133474 | Magnetoresistive random access memory and method of manufacturing the same | Hui-Lin Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu +10 more | 2024-10-29 |
| 11882769 | Magnetoresistive random access memory structure and method of manufacturing the same | Hui-Lin Wang, Bo Huang, Wen-Wen Zhang | 2024-01-23 |