Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089347 | Method of improving wire structure of circuit board and improving wire structure of circuit board | Chun-Yi Kuo, Ching Ku Lin | 2024-09-10 |
| 11924961 | Circuit board and method of manufacturing the same | Ai Jing Lin, Chung-Yu Lan | 2024-03-05 |