Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089347 | Method of improving wire structure of circuit board and improving wire structure of circuit board | Chun-Yi Kuo, Jia Hao Liang | 2024-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089347 | Method of improving wire structure of circuit board and improving wire structure of circuit board | Chun-Yi Kuo, Jia Hao Liang | 2024-09-10 |