Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881248 | Three-dimensional semiconductor module including system in a package (SIP) with improved heat dissipation efficiency | Fumitake OKUTSU | 2024-01-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881248 | Three-dimensional semiconductor module including system in a package (SIP) with improved heat dissipation efficiency | Fumitake OKUTSU | 2024-01-23 |