Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183713 | Semiconductor module, method for manufacturing same, and semiconductor module mounting body | — | 2024-12-31 |
| 11881248 | Three-dimensional semiconductor module including system in a package (SIP) with improved heat dissipation efficiency | Takao Adachi | 2024-01-23 |