Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11940856 | Output load identification method and the apparatus incorporating the same | Xinhai Li, Yaofeng Lin | 2024-03-26 |
| 11935863 | Laser reflow apparatus and laser reflow method | Satoshi Kobayashi, Youngsuk Kim, Nobuyuki Kimura, Yuki IKKU | 2024-03-19 |
| 11929344 | Die bonding for chip conveying apparatus | Hiromitsu Yoshimoto, Teppei NOMURA | 2024-03-12 |