Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030137 | Laser processing apparatus and method of adjusting phase pattern | Atsushi Ueki | 2024-07-09 |
| 11929344 | Die bonding for chip conveying apparatus | Hiromitsu Yoshimoto, Zhiwen Chen | 2024-03-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030137 | Laser processing apparatus and method of adjusting phase pattern | Atsushi Ueki | 2024-07-09 |
| 11929344 | Die bonding for chip conveying apparatus | Hiromitsu Yoshimoto, Zhiwen Chen | 2024-03-12 |