Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12177996 | Sensor package structure | CHIEN-CHEN LEE, Chia-Shuai Chang | 2024-12-24 |
| 12174446 | Sensor lens assembly having non-soldering configuration | Chia-Shuai Chang, CHIEN-CHEN LEE, Chien-Yuan Wang | 2024-12-24 |
| 12119363 | Sensor package structure | CHIEN-CHEN LEE, Ya-Han Chang | 2024-10-15 |
| 12113082 | Sensor package structure | Ya-Han Chang, CHIEN-CHEN LEE | 2024-10-08 |
| 12108517 | Sensor lens assembly having non-soldering configuration | Chia-Shuai Chang, CHIEN-CHEN LEE, Ya-Han Chang | 2024-10-01 |
| 12080659 | Sensor package structure | CHIEN-CHEN LEE | 2024-09-03 |
| 11984516 | Sensor package structure having ring-shaped solder mask frame | Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang | 2024-05-14 |
| 11967652 | Sensor package structure having solder mask frame | Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang | 2024-04-23 |