Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984516 | Sensor package structure having ring-shaped solder mask frame | Jui-Hung Hsu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang, LI-CHUN HUNG | 2024-05-14 |
| 11967652 | Sensor package structure having solder mask frame | Jui-Hung Hsu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang, LI-CHUN HUNG | 2024-04-23 |