Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176249 | 3D nano sheet method using 2D material integrated with conductive oxide for high performance devices | H. Jim Fulford, Mark I. Gardner | 2024-12-24 |
| 12131956 | Ultra dense 3D routing for compact 3D designs | H. Jim Fulford, Mark I. Gardner | 2024-10-29 |
| 12133387 | 3D memory with conductive dielectric channel integrated with logic access transistors | Mark I. Gardner, H. Jim Fulford | 2024-10-29 |
| 12114480 | Method of making of plurality of 3D vertical logic elements integrated with 3D memory | H. Jim Fulford, Mark I. Gardner | 2024-10-08 |
| 12068205 | 3D high density compact metal first approach for hybrid transistor designs without using epitaxial growth | Mark I. Gardner, H. Jim Fulford | 2024-08-20 |
| 12009355 | 3D stacked DRAM with 3D vertical circuit design | H. Jim Fulford, Mark I. Gardner | 2024-06-11 |