Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12023892 | Structure body, structure body manufacturing method, and electronic apparatus | Yuichi Takahashi, Shohei Abe, Gen Yonezawa, Takehito Shimatsu | 2024-07-02 |
| 11916038 | Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device | Takayuki Saitoh, Takayuki Moriwaki, Takehito Shimatsu | 2024-02-27 |
| 11865829 | Functional element and method of manufacturing functional element, and electronic apparatus | Yoshihisa Sato, Gen Yonezawa, Shohei Abe, Yuichi Takahashi, Takehito Shimatsu | 2024-01-09 |