Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916038 | Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device | Takayuki Moriwaki, Takehito Shimatsu, Miyuki UOMOTO | 2024-02-27 |