RW

Rongfu Wen

UC University of Colorado, A Body Corporate: 1 patents #29 of 200Top 15%
Overall (2024): #290,096 of 561,600Top 55%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11898807 Single and multi-layer mesh structures for enhanced thermal transport Ronggui Yang, Shanshan Xu, Yung-Cheng Lee 2024-02-13