Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104856 | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems | Ryan John Lewis, Ronggui Yang | 2024-10-01 |
| 11988453 | Thermal management planes | Ryan John Lewis, Ronggui Yang | 2024-05-21 |
| 11930621 | Folding thermal ground plane | Ryan John Lewis, Ali Nematollahisarvestani, Jason West, Kyle Wagner | 2024-03-12 |
| 11898807 | Single and multi-layer mesh structures for enhanced thermal transport | Ronggui Yang, Rongfu Wen, Shanshan Xu | 2024-02-13 |