Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100649 | Package comprising an integrated device with a back side metal layer | Wen Yin, Jay Scott Salmon | 2024-09-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100649 | Package comprising an integrated device with a back side metal layer | Wen Yin, Jay Scott Salmon | 2024-09-24 |