Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100649 | Package comprising an integrated device with a back side metal layer | Chien-Te Feng, Wen Yin | 2024-09-24 |
| 12100669 | Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods | Anirudh Bhat | 2024-09-24 |
| 11985804 | Package comprising a block device with a shield and method of fabricating the same | Anirudh Bhat | 2024-05-14 |