Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996382 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof | Nanako Maeda, Osamu Matsuzawa, Ryo Ishikawa, Takuya Kobayashi | 2024-05-28 |