Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996382 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof | Mitsuo Takada, Nanako Maeda, Osamu Matsuzawa, Takuya Kobayashi | 2024-05-28 |
| 11970834 | Work machine | Kazuhiro Kurihara, Takeshi Endou | 2024-04-30 |
| 11904406 | Laser processing head and laser processing system using same | Naoya Kato, Takayuki Yamashita, Doukei Nagayasu, Kenji Hoshino, Hideaki Yamaguchi +2 more | 2024-02-20 |
| 11892248 | Cooling unit and method for manufacturing cooling unit | Shozo Ochi, Masato Maede, Tomonari Nebashi | 2024-02-06 |