Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114503 | Integrated chip including a tunnel dielectric layer which has different thicknesses over a protrusion region of a substrate | Jui-Yu Pan, Cheng-Bo Shu, Chung-Jen Huang, Jing-Ru Lin, Tsung-Yu Yang +1 more | 2024-10-08 |