Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142514 | Clamp ring and method of using clamp ring | Chih-Wei Chou, Yin-Tun Chou, Hung-Chih Wang, Yu Liu, Chih-Ming Wang | 2024-11-12 |
| 12040163 | Connect structure for semiconductor processing equipment | Ming-Sze Chen, Hung-Chih Wang, Sheng Lin | 2024-07-16 |
| 12020994 | Power alarm and fire loading risk reduction for a deposition tool | Chih-Wei Chou, Sheng Lin, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2024-06-25 |
| 12002699 | Wafer pod transfer assembly | Chih-Wei Chou, Sheng Lin, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2024-06-04 |
| 11955317 | Radio frequency match strap assembly | Ming-Sze Chen, Yu WANG, Yin-Tun Chou, Sheng Lin | 2024-04-09 |
| 11862482 | Semiconductor substrate bonding tool and methods of operation | Yen-Hao Huang, Chun-Yi Chen, I-Shi Wang, Yin-Tun Chou, Sheng Lin | 2024-01-02 |