IW

I-Shi Wang

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Zhonglun, TW: #1 of 1 inventorsTop 100%
Overall (2024): #436,709 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11862482 Semiconductor substrate bonding tool and methods of operation Yen-Hao Huang, Chun-Yi Chen, Yin-Tun Chou, Yuan-Hsin Chi, Sheng Lin 2024-01-02