Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908731 | Via-first self-aligned interconnect formation process | Ya Hui Chang | 2024-02-20 |
YL
Yu-Tse LAI
Overall (2024): #201,646 of 561,600Top 40%
1
Patents 2024