Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165969 | Integrated circuit device and method | Nien-Yu Tsai, Min-Yuan Tsai, Wen-Ju Yang | 2024-12-10 |
| 12125850 | Buried metal track and methods forming same | Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang +6 more | 2024-10-22 |
| 12073166 | Method and structure for mandrel patterning | Yung Feng Chang, Pi-Yun Sun, Tung-Heng Hsieh, Bao-Ru Young | 2024-08-27 |
| 11881477 | Dummy poly layout for high density devices | Yung Feng Chang, Bao-Ru Young, Tzung-Chi Lee, Tung-Heng Hsieh, Chun-Chia Hsu | 2024-01-23 |
| 11868699 | Inverted integrated circuit and method of forming the same | Pochun Wang, Hui-Zhong Zhuang, Ting-Wei Chiang | 2024-01-09 |