Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948935 | Method of forming integrated circuit structure | Yung Feng Chang, Bao-Ru Young, Tung-Heng Hsieh | 2024-04-02 |
| 11881477 | Dummy poly layout for high density devices | Yung Feng Chang, Bao-Ru Young, Yu-Jung Chang, Tzung-Chi Lee, Tung-Heng Hsieh | 2024-01-23 |