Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154879 | Bump coplanarity for semiconductor device assembly and methods of manufacturing the same | Ko Han Lin | 2024-11-26 |
| 12068308 | Integrated circuit structure with avalanche junction to doped semiconductor over semiconductor well | Robert J. Gauthier, JR., Alain Loiseau, Souvick Mitra, Meng Miao, You Li | 2024-08-20 |