Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154879 | Bump coplanarity for semiconductor device assembly and methods of manufacturing the same | Tsung-Che Tsai | 2024-11-26 |
KL
Ko Han Lin
Overall (2024): #380,902 of 561,600Top 70%
1
Patents 2024