Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113132 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +5 more | 2024-10-08 |
| 12080588 | Buried metal for FinFET device and method | Chih-Liang Chen, Jiann-Tyng Tzeng, Chih-Ming Lai, Ru-Gun Liu, Charles Chew-Yuen Young | 2024-09-03 |
| 12034076 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Jack Liu, Kam-Tou Sio, Hui-Ting Yang, Wei-Cheng Lin +3 more | 2024-07-09 |
| 11916077 | Method for routing local interconnect structure at same level as reference metal line | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +5 more | 2024-02-27 |