Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183637 | Fin field-effect transistor and method of forming the same | Yu-Chi Pan, Ming-Hsi Yeh, Ying-Liang Chuang, Yu-Te Su, Kuan-Wei Lin | 2024-12-31 |
| 12176422 | Controlling fin-thinning through feedback | Tsu-Hui Su, Chun-Hsiang Fan, Yu-Wen Wang, Ming-Hsi Yeh | 2024-12-24 |
| 12136566 | Semiconductor device and method of manufacture | Yu-Shih Wang, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen +2 more | 2024-11-05 |
| 12074035 | Method for partially removing tungsten in semiconductor manufacturing process | Chia-Ling Chung, Chun-Chih Cheng, Ying-Liang Chuang, Ming-Hsi Yeh | 2024-08-27 |
| 12051619 | Semiconductor device and method of manufacture | Yu-Shih Wang, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen +2 more | 2024-07-30 |
| 12051626 | Fin Field-Effect transistor and method of forming the same | Chun-Cheng Chou, Ying-Liang Chuang, Chun-Neng Lin, Ming-Hsi Yeh | 2024-07-30 |
| 12046476 | Wet etching chemistry and method of forming semiconductor device using the same | Meng Li, Ying-Chuen Wang, Chieh-Yi Shen, Li-Min Chen, Ming-Hsi Yeh | 2024-07-23 |
| 11990339 | Semiconductor device and method of manufacture | Jian-Jou Lian, Yao-Wen Hsu, Neng-Jye Yang, Li-Min Chen, Chia-Wei Wu +1 more | 2024-05-21 |
| 11942362 | Surface modification layer for conductive feature formation | Jian-Jou Lian, Neng-Jye Yang, Li-Min Chen | 2024-03-26 |
| 11923437 | Controlling fin-thinning through feedback | Tsu-Hui Su, Chun-Hsiang Fan, Yu-Wen Wang, Ming-Hsi Yeh | 2024-03-05 |
| 11923428 | Fin field-effect transistor and method of forming the same | Yu-Chi Pan, Ying-Liang Chuang, Ming-Hsi Yeh | 2024-03-05 |
| 11923201 | Self-protective layer formed on high-K dielectric layer | Ju-Li Huang, Ying-Liang Chuang, Ming-Hsi Yeh | 2024-03-05 |
| 11901180 | Method of breaking through etch stop layer | Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, Po-Nan Yeh, U-Ting Chiu +2 more | 2024-02-13 |